Invention Grant
- Patent Title: Memory device
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Application No.: US16075474Application Date: 2017-02-03
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Publication No.: US10453510B2Publication Date: 2019-10-22
- Inventor: Jea Gun Park , Du Yeong Lee , Seung Eun Lee
- Applicant: Industry-University Cooperation Foundation Hanyang University
- Applicant Address: KR Seoul
- Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
- Current Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
- Current Assignee Address: KR Seoul
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2016-0015086 20160205; KR10-2016-0015139 20160205; KR10-2016-0015154 20160205; KR10-2016-0015176 20160205
- International Application: PCT/KR2017/001234 WO 20170203
- International Announcement: WO2017/135767 WO 20170810
- Main IPC: G11C11/16
- IPC: G11C11/16 ; H01L43/02 ; H01L43/08 ; H01L43/10 ; H01L43/12 ; H01L43/04

Abstract:
The present invention provides a memory device in which a lower electrode, a seed layer, synthetic antiferromagnetic (SyAF) layers, a separation layer, a magnetic tunnel junction, a capping layer, and an upper electrode are formed on a substrate in a laminated manner, wherein a diffusion barrier is formed between the magnetic tunnel junction and the capping layer. In addition, the present invention provides a memory device in which a lower electrode, a seed layer, SyAF layers, a separation layer, a magnetic tunnel junction, a capping layer, and an upper electrode are formed on a substrate in a laminated manner, wherein the seed layer is formed of a material that allows the SyAF layers to grow in the FCC (111) direction.
Public/Granted literature
- US20190043548A1 MEMORY DEVICE Public/Granted day:2019-02-07
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