Invention Grant
- Patent Title: Conductor assembly, electronic component using same, and manufacturing method thereof
-
Application No.: US15564442Application Date: 2016-12-15
-
Publication No.: US10453587B2Publication Date: 2019-10-22
- Inventor: Ikuya Wakamori , Kengo Nakamura , Mutsuyasu Ohtsubo
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2015-250147 20151222; JP2016-009421 20160121
- International Application: PCT/JP2016/005138 WO 20161215
- International Announcement: WO2017/110064 WO 20170629
- Main IPC: H01R4/02
- IPC: H01R4/02 ; H01B5/00 ; B23K11/14 ; H01B13/00 ; H05K3/20 ; H05K3/32 ; B23K11/11 ; B23K11/16 ; H01R43/02 ; B23K101/38 ; B23K103/12
Abstract:
A conductor assembly includes a first conductor made of metal and a second conductor bonded to the first conductor. The second conductor is made of a metal plate having first and second surfaces opposite to each other. The second conductor has a projection locally projecting from the first surface. A recess is provided in the second surface of the second conductor opposite to the projection. The projection of the second conductor has a portion contacting and entering into the first conductor. The projection of the second conductor is resistance-welded to the first conductor. The portion of the projection of the second conductor has two tips locally projecting from the portion of the projection of the second conductor and entering the first conductor.
Public/Granted literature
- US20180082764A1 CONDUCTOR ASSEMBLY, ELECTRONIC COMPONENT USING SAME, AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-03-22
Information query
