A semiconductor device comprises a plurality of first conductor portions 10, a plurality of second conductor portions 20 and a sealing portion 50, covering upper surfaces of the first conductor portion 10 and the second conductor portion 20. The first conductor portion 10 and the second conductor portion 20 are connected. Usage mode of the first terminal 11 and the second terminal 12 can be selected, and the second terminal 21 of the second conductor portion 20 serves as an output terminal in a case where the first terminal 11 of the first conductor portion 10 is used as a power supply terminal, and the first terminal 11 of the first conductor portion 10 serves as an output terminal in a case where the second terminal 21 is used as a power supply terminal.