Invention Grant
- Patent Title: Method for detecting thinning of an integrated circuit substrate via its rear face, and corresponding integrated circuit
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Application No.: US16129163Application Date: 2018-09-12
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Publication No.: US10453808B2Publication Date: 2019-10-22
- Inventor: Alexandre Sarafianos , Abderrezak Marzaki
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Crowe & Dunlevy
- Priority: FR1758480 20170913
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/66 ; H01L29/861 ; H01L29/06
Abstract:
An electronic integrated circuit includes a semiconductor substrate having a rear face. A device for detecting a thinning of the semiconductor substrate via its rear face is formed by a p-n junction that is biased into conduction. Thinning of the substrate is detected by monitoring a current flowing through the p-n junction, and comparing that current to a threshold. In the event the compared current indicates no thinning of the semiconductor substrate, the circuitry for biasing and comparing is deactivated.
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