Invention Grant
- Patent Title: Semiconductor device having a field electrode and a gate electrode in a trench structure and manufacturing method
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Application No.: US15941637Application Date: 2018-03-30
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Publication No.: US10453915B2Publication Date: 2019-10-22
- Inventor: Andreas Meiser , Karl-Heinz Bach , Christian Kampen , Dietmar Kotz , Andrew Christopher Graeme Wood , Markus Zundel
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102017107020 20170331
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/40 ; H01L29/10 ; H01L29/78 ; H01L29/66 ; H01L21/266 ; H01L29/36 ; H01L21/265

Abstract:
A semiconductor device includes a semiconductor body having a semiconductor substrate of a first conductivity type and a semiconductor layer of the first conductivity type on the substrate. A trench structure extends into the semiconductor body from a first surface and includes a gate electrode and at least one field electrode arranged between the gate electrode and a bottom side of the trench structure. A body region adjoins the trench structure and laterally extends from a transistor cell area into an edge termination area. A pn junction is between the body region and semiconductor layer. A doping concentration of at least one of the body region and semiconductor layer is lowered at a lateral end of the pn junction in the edge termination area compared to a doping concentration of the at least one of the body region and semiconductor layer at the pn junction in the transistor cell area.
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