- Patent Title: Silicon carbide semiconductor substrate, method of manufacturing silicon carbide semiconductor substrate, semiconductor device and method of manufacturing semiconductor device
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Application No.: US16019531Application Date: 2018-06-26
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Publication No.: US10453924B2Publication Date: 2019-10-22
- Inventor: Takeshi Tawara , Hidekazu Tsuchida , Tetsuya Miyazawa
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Main IPC: H01L29/16
- IPC: H01L29/16 ; C30B29/36 ; C30B25/18 ; C30B25/20 ; H01L21/02 ; H01L21/04 ; H01L29/36

Abstract:
A silicon carbide semiconductor substrate, including a silicon carbide substrate of a first conductivity type, a buffer layer of the first conductivity type and an epitaxial layer of the first conductivity type. The silicon carbide substrate has a central part and a peripheral part surrounding the central part, and is doped with a first impurity that determines the first conductivity type. The buffer layer is provided on a front surface of the central part of the silicon carbide substrate, and is doped with the first impurity, of which a concentration is at least 1.0×1018/cm3, and a second impurity different from the first impurity. The epitaxial layer is provided on a front surface of the peripheral part of the silicon carbide substrate, and is doped with the first impurity, of which a concentration is lower than the concentration of the first impurity in the buffer layer.
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