Silicon carbide semiconductor substrate, method of manufacturing silicon carbide semiconductor substrate, semiconductor device and method of manufacturing semiconductor device
Abstract:
A silicon carbide semiconductor substrate, including a silicon carbide substrate of a first conductivity type, a buffer layer of the first conductivity type and an epitaxial layer of the first conductivity type. The silicon carbide substrate has a central part and a peripheral part surrounding the central part, and is doped with a first impurity that determines the first conductivity type. The buffer layer is provided on a front surface of the central part of the silicon carbide substrate, and is doped with the first impurity, of which a concentration is at least 1.0×1018/cm3, and a second impurity different from the first impurity. The epitaxial layer is provided on a front surface of the peripheral part of the silicon carbide substrate, and is doped with the first impurity, of which a concentration is lower than the concentration of the first impurity in the buffer layer.
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