Invention Grant
- Patent Title: Microphone configurations
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Application No.: US15727334Application Date: 2017-10-06
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Publication No.: US10455321B2Publication Date: 2019-10-22
- Inventor: Ricardo De Jesus Bernal Castillo , Wade Heimbigner , Dipanjan Sen
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated—Toler
- Main IPC: H04R1/08
- IPC: H04R1/08 ; H04R9/08 ; H04R11/04 ; H04R1/32 ; H04R1/02 ; H04R5/027 ; H04R1/40 ; H04R3/00 ; H04R3/02 ; H04S7/00

Abstract:
A microphone device includes a microphone array configured to capture one or more audio objects associated with a three-dimensional sound field. The microphone array includes clusters of two or more microphone elements. Each cluster includes one or more acoustic port openings and two or more microphone elements coupled to the one or more acoustic port openings via corresponding acoustic ports. The microphone device also includes a processor coupled to the microphone array.
Public/Granted literature
- US20180317002A1 MICROPHONE CONFIGURATIONS Public/Granted day:2018-11-01
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