The invention concerns a microphone probe having a body being substantially a first solid of revolution with a number of audio sensors distributed thereon and located in the recesses. The recesses have substantially a shape of a second body of revolution with an axis of symmetry perpendicular to the surface of the body. The sensors are connected to an acquisition unit, that delivers audio signals to the output. The audio sensors are digital audio sensors comprising printed circuit board with MEMS microphone element mounted thereon, wherein MEMS microphone element is mounted on the side of the printed circuit board facing the inner side of the body, so that the sound reaches MEMS microphone element via recess and opening. The depth of recesses is in a range between 3 and 20 mm. The acquisition unit has a clocking device determining common time base for audio sensors.