Invention Grant
- Patent Title: Thick film element having covering layer with high heat conductivity
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Application No.: US15534487Application Date: 2016-03-26
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Publication No.: US10455643B2Publication Date: 2019-10-22
- Inventor: Weicong Huang
- Applicant: GUANGDONG FLEXWARM ADVANCED MATERIALS & TECHNOLOGY CO., LTD.
- Applicant Address: CN Guangzhou, Guangdong
- Assignee: GUANGDONG FLEXWARM ADVANCED MATERIALS & TECHNOLOGY CO., LTD.
- Current Assignee: GUANGDONG FLEXWARM ADVANCED MATERIALS & TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Guangzhou, Guangdong
- Priority: CN201610076006 20160203
- International Application: PCT/CN2016/077441 WO 20160326
- International Announcement: WO2017/133069 WO 20170810
- Main IPC: H05B3/12
- IPC: H05B3/12 ; H05B3/02 ; H05B3/22 ; H05B3/34 ; F28F3/04

Abstract:
The present invention provides a thick film element having a covering layer with high heat conductivity, which comprises a carrier, a thick film coating deposited on the carrier and a covering layer overlaid on the coating. The thick film coating is a heating materials, and the mode of heating is electrical heating. The covering layer, the thick film coating and the carrier are selected from a material that fulfills every of the following equations: λ 1 A T 1 - T 0 d 1 = a × λ 3 A T 3 - T 0 d 3 , λ 2 A T 2 - T 0 d 2 = b × λ 1 A T 1 - T 0 d 1 , λ 2 A T 2 - T 0 d 2 = c × λ 3 A T 3 - T 0 d 3 ; wherein 200≤a≤104, 0
Public/Granted literature
- US20180352609A1 THICK FILM ELEMENT HAVING COVERING LAYER WITH HIGH HEAT CONDUCTIVITY Public/Granted day:2018-12-06
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