Invention Grant
- Patent Title: Clamping spring design to apply clamping force to SMT power amplifier device
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Application No.: US15679919Application Date: 2017-08-17
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Publication No.: US10455686B2Publication Date: 2019-10-22
- Inventor: Gerald A. Tang-Kong
- Applicant: Panasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America
- Applicant Address: US GA Peachtree City
- Assignee: Panasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America
- Current Assignee: Panasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America
- Current Assignee Address: US GA Peachtree City
- Agent Laurence S. Roach, Esq.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H03F3/20 ; H05K1/18 ; H05K5/00 ; H03F1/30 ; H05K7/20
Abstract:
A power amplifier arrangement for a motor vehicle includes a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board. A power amplifier is mounted on the second side of the printed circuit board. A bracket is supported by the housing. A clamping spring is supported by the bracket such that the clamping spring is in biased engagement with the first side of the printed circuit board, and such that the power amplifier is pressed into engagement with the heat sink.
Public/Granted literature
- US20180054882A1 CLAMPING SPRING DESIGN TO APPLY CLAMPING FORCE TO SMT POWER AMPLIFIER DEVICE Public/Granted day:2018-02-22
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