Invention Grant
- Patent Title: Implementation method for stacked connection between isolated circuit components and the circuit thereof
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Application No.: US15860103Application Date: 2018-01-02
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Publication No.: US10455717B2Publication Date: 2019-10-22
- Inventor: Yipu Zheng
- Applicant: SHENZHEN XILONG TOY COMPANY LIMITED
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN XILONG TOY COMPANY LIMITED
- Current Assignee: SHENZHEN XILONG TOY COMPANY LIMITED
- Current Assignee Address: CN Shenzhen
- Agency: Anova Law Group, PLLC
- Priority: CN201610259246 20160425
- Main IPC: H01L23/482
- IPC: H01L23/482 ; H05K7/00 ; H01L23/00 ; H01L29/861 ; H01L25/16 ; H01L29/73

Abstract:
The present invention discloses a modularized circuit for isolated circuit, wherein the isolated circuit includes at least two circuit components connecting in parallel and/or series, the circuit components, according to a circuit connection configuration, weld corresponding pins of the components directly, forming an integrated module in accordance with a desired connection method of the circuit, and saving circuit boards and wires; the circuit components are designed as a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped. Due to constructing a circuit unit by welding connections in a way of building blocks, welding directly between components in a 3D space, comparing to the circuits limited in a circuit board plane as a PCB, it owns a wider design space.
Public/Granted literature
- US20180124941A1 IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCUIT COMPONENTS AND THE CIRCUIT THEREOF Public/Granted day:2018-05-03
Information query
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