Invention Grant
- Patent Title: Airtight penetration structure for heat dissipation device
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Application No.: US15826603Application Date: 2017-11-29
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Publication No.: US10458718B2Publication Date: 2019-10-29
- Inventor: Ching-Hang Shen , Fu-Kuei Chang
- Applicant: ASIA VITAL COMPONENTS CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: ASIA VITAL COMPONENTS CO., LTD.
- Current Assignee: ASIA VITAL COMPONENTS CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Jackson IPG PLLC
- Agent Demian K. Jackson
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28F3/08 ; F28D15/04

Abstract:
An airtight penetration structure for heat dissipation device includes a first plate member, a second plate member, and a plurality of hollow shaft members. The first and the second plate member are closed to each other to together define a closed chamber between them. The hollow shaft members are respectively provided at two free ends with a first and a second flange. The hollow shaft members are correspondingly extended through fastening holes provided on the first and the second plate member with the first and the second flanges attached to and flush with outer surfaces of the first and the second plate member to seal around the fastening holes, so that the closed chamber between the first and the second plate member is in an airtight state.
Public/Granted literature
- US20190162480A1 AIRTIGHT PENETRATION STRUCTURE FOR HEAT DISSIPATION DEVICE Public/Granted day:2019-05-30
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