Invention Grant
- Patent Title: Multilayer electronic component and board having the same
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Application No.: US16003222Application Date: 2018-06-08
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Publication No.: US10460883B2Publication Date: 2019-10-29
- Inventor: In Wha Jeong , Jae Suk Sung , Hugh Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0125669 20150904
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01G15/00 ; H01G4/30 ; H01G7/06 ; H01G2/06 ; H01G4/012 ; H01G4/232

Abstract:
A multilayer electronic component includes a ceramic body having stacked dielectric layers to form a first capacitor part and a second capacitor part, wherein the first capacitor has a constant capacitance, and the second capacitor part has a variable capacitance; a voltage control terminal formed on a lateral surface of the ceramic body; an input terminal disposed on another lateral surface of the ceramic body corresponding to the first capacitor part; and an output terminal disposed on the other lateral surface of the ceramic body corresponding to the second capacitor part separate from the input terminal.
Public/Granted literature
- US20180294107A1 MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2018-10-11
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