Invention Grant
- Patent Title: Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing package
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Application No.: US15527779Application Date: 2015-11-17
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Publication No.: US10461001B2Publication Date: 2019-10-29
- Inventor: Masayuki Yokota , Masaharu Yamamoto
- Applicant: HITACHI METALS, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2014-250728 20141211
- International Application: PCT/JP2015/082189 WO 20151117
- International Announcement: WO2016/093021 WO 20160616
- Main IPC: H05K5/06
- IPC: H05K5/06 ; H01L23/10 ; H01L23/02 ; H03H3/02 ; H03H9/02 ; H01L23/04 ; H01L23/06 ; H03H9/10 ; H03H9/13
Abstract:
This method for manufacturing a hermetic sealing lid member (1, 201, 301) includes forming a Ni plated metal plate (70, 170) by forming a Ni plated layer (11, 12, 41) on a surface of a metal plate (40) having a corrosion resistance and forming the hermetic sealing lid member by punching the Ni plated metal plate.
Public/Granted literature
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