Invention Grant
- Patent Title: Light-emitting device
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Application No.: US15077143Application Date: 2016-03-22
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Publication No.: US10461063B2Publication Date: 2019-10-29
- Inventor: Keiichi Maki
- Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Applicant Address: JP Asahikawa-Shi
- Assignee: Toshiba Hokuto Electronics Corporation
- Current Assignee: Toshiba Hokuto Electronics Corporation
- Current Assignee Address: JP Asahikawa-Shi
- Agency: Burr & Brown, PLLC
- Priority: JP2013-249455 20131202
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L23/31 ; H01L23/538 ; H01L33/42 ; H01L33/56 ; H01L33/62 ; H05K1/02 ; H05K1/18 ; H05K3/32 ; H05K3/36

Abstract:
A light-emitting device according to an embodiment includes a light-emitting part and an external wiring. The light-emitting part includes: a pair of insulating substrates that has light transmissive property and flexibility; a plurality of light-emitting elements arranged between the pair of insulating substrates; an internal wiring pattern that is provided between the pair of insulating substrates, and is connected to the light-emitting elements; and a resin layer that has light transmissive property and insulating property, and is provided between the pair of insulating substrates. An end of the external wiring is divided into a plurality of wirings having a line width that is narrower than a line width of the internal wiring pattern. An end of the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive.
Public/Granted literature
- US20160276321A1 LIGHT-EMITTING DEVICE Public/Granted day:2016-09-22
Information query
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