Invention Grant
- Patent Title: Creating devices with multiple threshold voltage by cut-metal-gate process
-
Application No.: US15904585Application Date: 2018-02-26
-
Publication No.: US10461078B2Publication Date: 2019-10-29
- Inventor: Ming-Chang Wen , Chang-Yun Chang , Hsien-Chin Lin , Bone-Fong Wu , Ya-Hsiu Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L27/02 ; H01L29/49 ; H01L21/8234 ; H01L29/06 ; H01L21/3213 ; H01L29/66 ; H01L21/027 ; H01L21/28 ; H01L29/423

Abstract:
A semiconductor device includes first and second transistors each having a high-k metal gate disposed over a respective channel region of the transistors. The semiconductor device further includes first and second dielectric features in physical contact with an end of the respective high-k metal gates. The first and second transistors are of a same conductivity type. The two high-k metal gates have a same number of material layers. The first transistor's threshold voltage is different from the second transistor's threshold voltage, and at least one of following is true: the two high-k metal gates have different widths, the first and second dielectric features have different distances from respective channel regions of the two transistors, and the first and second dielectric features have different dimensions.
Public/Granted literature
- US20190267372A1 Creating Devices with Multiple Threshold Voltage by Cut-Metal-Gate Process Public/Granted day:2019-08-29
Information query
IPC分类: