Invention Grant
- Patent Title: Wafer level package with integrated or embedded antenna
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Application No.: US15861338Application Date: 2018-01-03
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Publication No.: US10461399B2Publication Date: 2019-10-29
- Inventor: Ivan Ndip , Tanja Braun
- Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Applicant Address: DE Munich
- Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Current Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Current Assignee Address: DE Munich
- Agency: Perkins Coie LLP
- Agent Michael A. Glenn
- Priority: DE102017200124 20170105
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/538 ; H01L23/552 ; H01Q1/22 ; H01L23/66 ; H01L25/10 ; H01Q15/02
Abstract:
A wafer level package with integrated antenna includes a contacting layer, a redistribution layer as well as a chip layer arranged between the contacting layer and the redistribution layer. An antenna is integrated in the redistribution layer. The antenna is shielded from the chip by means of a via, offset and provided with a reflector. Alternatively, the antenna can also be provided as antenna element in the chip layer.
Public/Granted literature
- US10424827B2 Wafer level package with integrated or embedded antenna Public/Granted day:2019-09-24
Information query
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