Invention Grant
- Patent Title: Pressure contact terminal for connecting electronic component and wire
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Application No.: US15987014Application Date: 2018-05-23
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Publication No.: US10461442B2Publication Date: 2019-10-29
- Inventor: Tetsuro Takasaki
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2017-109016 20170601
- Main IPC: H01R4/24
- IPC: H01R4/24 ; H01R4/2429 ; H01R33/09 ; H01R12/71

Abstract:
A pressure contact terminal includes a component clip configured to clip an electronic component and be electrically connected with the electronic component, a pressure contact blade to be connected with a wire by pressure contact, and a step connection configured to connect the component clip and the pressure contact blade to each other at different bottom face heights. The step connection of the pressure contact terminal may prevent displacement of the pressure contact blade from being transmitted to the component clip.
Public/Granted literature
- US20180351266A1 PRESSURE CONTACT TERMINAL FOR CONNECTING ELECTRONIC COMPONENT AND WIRE Public/Granted day:2018-12-06
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