Invention Grant
- Patent Title: Interleaving and puncturing apparatus and method thereof
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Application No.: US15581377Application Date: 2017-04-28
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Publication No.: US10461778B2Publication Date: 2019-10-29
- Inventor: Hong-sil Jeong , Sang-hyo Kim , Kyung-joong Kim , Se-ho Myung , Jong-hwan Kim , Dae-hyun Ryu , Min Jang
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Applicant Address: KR Suwon-si KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Current Assignee Address: KR Suwon-si KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0058327 20140515
- Main IPC: H03M13/27
- IPC: H03M13/27 ; H03M13/13 ; H03M13/00

Abstract:
An apparatus and method for interleaving and puncturing are provided. The apparatus includes: an interleaver formed of a plurality of columns and rows, configured to perform interleaving by writing bits input to the interleaver in the plurality of columns and reading the bits from each row of the plurality of columns in which the bits are written; and a puncturer configured to puncture a predetermined number of bits among the bits read from the interleaver.
Public/Granted literature
- US20170230063A1 INTERLEAVING AND PUNCTURING APPARATUS AND METHOD THEREOF Public/Granted day:2017-08-10
Information query
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