Invention Grant
- Patent Title: Wiring board manufacturing method and wiring board manufacturing device
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Application No.: US15524128Application Date: 2014-11-14
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Publication No.: US10462909B2Publication Date: 2019-10-29
- Inventor: Kenji Tsukada , Masatoshi Fujita , Yoshitaka Hashimoto , Akihiro Kawajiri , Masato Suzuki
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2014/080244 WO 20141114
- International Announcement: WO2016/075823 WO 20160519
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K3/12 ; B33Y50/02 ; B29C64/124 ; B29C64/393 ; B41M3/00 ; B41M7/00 ; B29C64/112 ; B29C64/336 ; B33Y10/00 ; B33Y30/00 ; B33Y80/00 ; B29L31/34 ; H05K1/09

Abstract:
A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.
Public/Granted literature
- US20180302991A1 WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD MANUFACTURING DEVICE Public/Granted day:2018-10-18
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