Invention Grant
- Patent Title: Heat sink assembly
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Application No.: US15804484Application Date: 2017-11-06
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Publication No.: US10462941B2Publication Date: 2019-10-29
- Inventor: Keith Elliot Dixler , Jon Nathaniel Husser , Allen Ben Chu , Todd George Nakanishi
- Applicant: Caterpillar Inc.
- Applicant Address: US IL Peoria
- Assignee: Caterpillar Inc.
- Current Assignee: Caterpillar Inc.
- Current Assignee Address: US IL Peoria
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat sink assembly for a power module is provided. The assembly includes a main body having a first cooling circuit and a second cooling circuit. The first cooling circuit includes a first plurality of channels, at least one first end channel, at least one second end channel, a first inlet, and a first outlet. The first cooling circuit is adapted to provide a first flow of a coolant through the main body. The second cooling circuit includes a second plurality of passages, at least one first end passage, at least one second end passage, a second inlet, and a second outlet. The second cooling circuit is adapted to provide a second flow of the coolant through the main body. The first cooling circuit and second cooling circuit is adapted to provide a cross flow of the first flow and second flow through the main body respectively.
Public/Granted literature
- US20190141864A1 HEAT SINK ASSEMBLY Public/Granted day:2019-05-09
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