Invention Grant
- Patent Title: Component mounting machine
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Application No.: US15025064Application Date: 2013-10-31
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Publication No.: US10462947B2Publication Date: 2019-10-29
- Inventor: Hidetoshi Ito , Yoshihiro Yasui
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2013/079601 WO 20131031
- International Announcement: WO2015/063934 WO 20150507
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K13/00 ; H05K13/02 ; H05K13/08

Abstract:
Provided are a first component holding tool operating device which operates one component holding tool which is positioned at a first position set on one circumference among the plurality of component holding tools for holding and disengaging a component, and a second holding tool operating device which operates one component holding tool which is positioned at a second position set on the circumference among the plurality of component holding tools for holding and disengaging the component. The first position and the second position are set so that the second position is positioned in the middle of two adjacent component holding tools among the plurality of component holding tools when one of the plurality of component holding tools is positioned at the first position.
Public/Granted literature
- US20160249497A1 COMPONENT MOUNTING MACHINE Public/Granted day:2016-08-25
Information query