Invention Grant
- Patent Title: Substrate, edge polishing detection method and device and positioning method and device for the same, exposure apparatus and evaporation device
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Application No.: US15545074Application Date: 2017-02-16
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Publication No.: US10464190B2Publication Date: 2019-11-05
- Inventor: Qiang Wang , Libin Liu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Applicant Address: CN Beijing CN Ordos, Inner Mongolia
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Current Assignee Address: CN Beijing CN Ordos, Inner Mongolia
- Agency: Brooks Kushman P.C.
- Priority: CN201610342023 20160520
- International Application: PCT/CN2017/073758 WO 20170216
- International Announcement: WO2017/197936 WO 20171123
- Main IPC: B24B49/10
- IPC: B24B49/10 ; B24B49/04 ; B24B9/10 ; B24B21/02
Abstract:
A substrate, an edge polishing detection method and device and a positioning method and device for the same, an exposure apparatus and an evaporation device are provided. The substrate includes a base substrate and at least one edge polishing detection pattern on the base substrate. The at least one edge polishing detection pattern is provided at an edge of the base substrate and made of a conductive material.
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