Invention Grant
- Patent Title: Device for heating preform bodies or flat or preformed semi-finished products from thermoplastic material
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Application No.: US14902452Application Date: 2014-06-24
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Publication No.: US10464236B2Publication Date: 2019-11-05
- Inventor: Ronald Claus , Marcus Stein , Sascha Bach
- Applicant: watttron GmbH
- Applicant Address: DE Freital
- Assignee: WATTTRON GMBH
- Current Assignee: WATTTRON GMBH
- Current Assignee Address: DE Freital
- Agency: Jacobson Holman, PLLC
- Priority: DE102013011306 20130703; DE102014202302 20140207
- International Application: PCT/EP2014/063293 WO 20140624
- International Announcement: WO2015/000748 WO 20150108
- Main IPC: B29C49/64
- IPC: B29C49/64 ; B29C49/12 ; B29B13/02 ; B29C51/42 ; H05B3/14 ; H05B3/46 ; B29K105/00 ; B29C49/68 ; B29C35/08 ; B29C35/02

Abstract:
The invention relates to a device for heating preform bodies or flat or preformed semi-finished products from thermoplastic material (3), comprising at least one base body (1.0, 2.0), on the surface of which at least a first layer or coating is formed, which comprises at least one electric heating resistor in the form of a flat, geometrically arranged conductor loop. The base body also has contact elements, by which the at least one heating resistor can be connected to a power source, wherein, as a result of the geometrically arranged conductor loop(s), a defined temperature profile can be generated, which can be transmitted contactlessly to the preform body or the semi-finished product by an outer contact layer formed on the first layer or coating, by contact the surface of a preform body or semi-finished product and/or by using convection or thermal radiation. During a transmission of the defined temperature profile, the preform body or the semi-finished product is arranged at a distance to the contact layer(s).
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