Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
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Application No.: US16030699Application Date: 2018-07-09
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Publication No.: US10464317B2Publication Date: 2019-11-05
- Inventor: Eiju Hirai , Motoki Takabe , Daisuke Yamada , Yoichiro Kondo , Shunya Fukuda
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2017-136863 20170713
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14

Abstract:
A liquid ejecting head includes a drive element, a drive circuit that outputs a signal for driving the drive element, and a wiring board. The wiring board is provided with a power supply wire through which power is supplied to the drive circuit, a first drive signal wire through which a first drive signal is supplied to the drive circuit, and a second drive signal wire through which a second drive signal is supplied to the drive circuit and that is not electrically connected to the power supply wire and the first drive signal wire on the wiring board, each of the first drive signal wire and the second drive signal wire is provided with a buried wire that is buried in a groove, and the first drive signal wire and the second drive signal wire are different from each other in number of the buried wires.
Public/Granted literature
- US20190016126A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2019-01-17
Information query
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