Invention Grant
- Patent Title: Molded fluid flow structure
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Application No.: US15872713Application Date: 2018-01-16
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Publication No.: US10464324B2Publication Date: 2019-11-05
- Inventor: Chien-Hua Chen , Michael W. Cumbie
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agent Fabian VanCott
- Main IPC: B41J2/155
- IPC: B41J2/155 ; B41J2/14 ; B41J2/16 ; B41J2/145 ; B41J25/34

Abstract:
A method of manufacturing a fluid flow structure may include coupling a flex circuit to a carrier. The flex circuit may include at least one conductor. The method may include coupling an orifice side of a fluidic die to the carrier at an opening on the carrier. The fluidic die may include at least one electrical terminal. The method may include coupling the electrical terminal to the conductor, and overmolding the fluid flow structure with a moldable material. The overmolded fluid flow structure may include a channel molded therein, and the channel may be fluidically coupled to the fluidic die. The conductor may be surrounded by the moldable material.
Public/Granted literature
- US20180134039A1 MOLDED FLUID FLOW STRUCTURE Public/Granted day:2018-05-17
Information query
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