Invention Grant
- Patent Title: Fluid supply integration module
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Application No.: US15763495Application Date: 2016-01-22
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Publication No.: US10464333B2Publication Date: 2019-11-05
- Inventor: Chris Arnold
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanaugh PC
- Agent Nathan Rieth
- International Application: PCT/US2016/014405 WO 20160122
- International Announcement: WO2017/127100 WO 20170727
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
A fluid supply integration module in a fluid dispensing device includes an on-board reservoir to store fluid, and a fluid interconnect to fluidically couple an external fluid supply container to the on-board reservoir. The fluid supply integration module includes a check valve system disposed between the on-board reservoir and the fluid interconnect. The check valve system includes a first check valve to permit fluid to flow in a first direction and a second check valve to permit air to flow in a second direction opposite the first direction.
Public/Granted literature
- US20180311966A1 FLUID SUPPLY INTEGRATION MODULE Public/Granted day:2018-11-01
Information query
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