Invention Grant
- Patent Title: Method for producing flexible conductive substrate with high transmittance and product thereof
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Application No.: US15803871Application Date: 2017-11-06
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Publication No.: US10465056B2Publication Date: 2019-11-05
- Inventor: Wei-Ping Dow , Po-Ting Chen , Liang-Jie Lin , Hung-Ming Chang , Ting-Yun Lin , Fang-Yu Lin
- Applicant: NATIONAL CHUNG HSING UNIVERSITY
- Applicant Address: TW Taichung
- Assignee: NATIONAL CHUNG HSING UNIVERSITY
- Current Assignee: NATIONAL CHUNG HSING UNIVERSITY
- Current Assignee Address: TW Taichung
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Priority: TW106117261 20170524
- Main IPC: B23B3/00
- IPC: B23B3/00 ; C08J7/12 ; C23C18/16 ; H01B5/14 ; C23C18/20 ; C23C18/30 ; H01B3/30 ; G03F7/20 ; G03F7/30 ; C23F1/00 ; H01B3/44 ; H01B3/42 ; C23F1/02 ; C23C18/38
Abstract:
The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.
Public/Granted literature
- US20180340050A1 METHOD FOR PRODUCING FLEXIBLE CONDUCTIVE SUBSTRATE WITH HIGH TRANSMITTANCE AND PRODUCT THEREOF Public/Granted day:2018-11-29
Information query
