Invention Grant
- Patent Title: Method of manufacturing conductive film holes
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Application No.: US15479747Application Date: 2017-04-05
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Publication No.: US10465607B2Publication Date: 2019-11-05
- Inventor: Kevin L. Zacchera , Thomas N. Slavens
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Bachman & LaPointe, P.C.
- Main IPC: F23R3/00
- IPC: F23R3/00 ; F02C7/18 ; C23C14/04 ; F01D5/18 ; F01D5/28 ; C23C4/01
Abstract:
A method for applying a coating to a substrate having a plurality of holes. The method comprises: applying a braze material to a substrate having a plurality of holes; heating the substrate to melt the braze material to form a melt; cooling the substrate to solidify the melt to form plugs in the respective holes; applying a coating to the substrate; and further heating the substrate to melt the plugs.
Public/Granted literature
- US20180291811A1 Method of Manufacturing Conductive Film Holes Public/Granted day:2018-10-11
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