Invention Grant
- Patent Title: Sensor assembly
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Application No.: US15663275Application Date: 2017-07-28
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Publication No.: US10466229B2Publication Date: 2019-11-05
- Inventor: Matthias Schibli , Daniel Lehmann
- Applicant: SENSIRION AG
- Applicant Address: CH Stäfa
- Assignee: SENSIRION AG
- Current Assignee: SENSIRION AG
- Current Assignee Address: CH Stäfa
- Agency: Mannava & Kang, P.C.
- Priority: EP16001844 20160823
- Main IPC: G01N33/487
- IPC: G01N33/487 ; H01L23/31 ; G01N27/12

Abstract:
A sensor assembly comprises a substrate arrangement and a sensor chip mounted to the substrate arrangement. A sensing element is integrated on or in the sensor chip and is sensitive to at least one parameter of a fluid. An access opening is provided in the substrate arrangement enabling the fluid to access the sensing element. A metallization arranged on at least a portion of the substrate arrangement seals a chamber containing the sensor chip which portion comprises one or more of a wall defining the access opening or an area facing the sensor chip.
Public/Granted literature
- US20180059091A1 SENSOR ASSEMBLY Public/Granted day:2018-03-01
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