Invention Grant
- Patent Title: System and method for field-by-field overlay process control using measured and estimated field parameters
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Application No.: US14186744Application Date: 2014-02-21
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Publication No.: US10466596B2Publication Date: 2019-11-05
- Inventor: Bill Pierson , Ramkumar Karur-Shanmugam , Chin-Chou Huang , Ady Levy , John Charles Robinson
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G03F7/20
- IPC: G03F7/20
Abstract:
The present disclosure is directed to a method of determining at least one correctable for a process tool. In an embodiment, the method includes the steps of: measuring one or more parameter values at one or more measurement locations of each field of a selection of measured fields of a wafer; estimating one or more parameter values for one or more locations of each field of a selection of unmeasured fields of the wafer; and determining at least one correctable for a process tool based upon the one or more parameter values measured at the one or more measurement locations of each field of the selection of measured fields of the wafer and the one or more parameter values estimated for the one or more locations of each field of the selection of unmeasured fields of the wafer.
Public/Granted literature
Information query
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