Invention Grant
- Patent Title: High density multi node computer with improved efficiency, thermal control, and compute performance
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Application No.: US15264441Application Date: 2016-09-13
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Publication No.: US10467021B2Publication Date: 2019-11-05
- Inventor: Tung M. Nguyen , Syed Najaf Rizvi , David Nguyen , Adam Drobot , Eric Anderson
- Applicant: Advanced Green Computing Machines-IP, Limited
- Applicant Address: CN Hong Kong
- Assignee: Advanced Green Computing Machines-IP
- Current Assignee: Advanced Green Computing Machines-IP
- Current Assignee Address: CN Hong Kong
- Main IPC: G06F9/445
- IPC: G06F9/445 ; G06F1/20 ; G06F1/26 ; G06F1/18 ; G06F13/40

Abstract:
A multi-node computer system, comprising: a plurality of nodes, a system control unit and a carrier board. Each node of the plurality of nodes comprises a processor and a memory. The system control unit is responsible for: power management, cooling, workload provisioning, native storage servicing, and I/O. The carrier board comprises a system fabric and a plurality of electrical connections. The electrical connections provide the plurality of nodes with power, management controls, system connectivity between the system control unit and the plurality of nodes, and an external network connection to a user infrastructure. The system control unit and the carrier board provide integrated, shared resources for the plurality of nodes. The multi-node computer system is provided in a single enclosure.
Public/Granted literature
- US20170052801A1 HIGH DENSITY MULTI NODE COMPUTER WITH IMPROVED EFFICIENCY, THERMAL CONTROL, AND COMPUTE PERFORMANCE Public/Granted day:2017-02-23
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