Invention Grant
- Patent Title: Data packing techniques for hard-wired multiplier circuits
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Application No.: US15603908Application Date: 2017-05-24
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Publication No.: US10467324B2Publication Date: 2019-11-05
- Inventor: Eric Sen Chung , Jeremy Halden Fowers , Shlomo Alkalay
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agency: Watson Patents, PLC
- Agent Vladan M. Vasiljevic
- Main IPC: G06F17/16
- IPC: G06F17/16 ; G06F7/46 ; G06F7/53 ; G06F17/10 ; G06N20/00

Abstract:
A method is provided that includes providing a hard-wired integer multiplier circuit configured to multiply a first physical operand and a second physical operand, mapping a first logical operand to a first portion of the first physical operand, mapping a second logical operand to a second portion of the first physical operand, and mapping a third logical operand to the second physical operand. The method further includes multiplying the first physical operand and the second physical operand using the hard-wired integer multiplier circuit to provide a multiplication result that includes a first portion including a product of the first logical operand and the third logical operand, and a second portion including a product of the second logical operand and the third logical operand.
Public/Granted literature
- US20180341622A1 DATA PACKING TECHNIQUES FOR HARD-WIRED MULTIPLIER CIRCUITS Public/Granted day:2018-11-29
Information query