Invention Grant
- Patent Title: Wiring member, manufacturing method of wiring member, and wiring member connection structure
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Application No.: US15840190Application Date: 2017-12-13
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Publication No.: US10468161B2Publication Date: 2019-11-05
- Inventor: Yasuhiro Kominato , Shingo Kato , Shigeki Iimuro
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2016-244781 20161216; JP2017-086562 20170425
- Main IPC: B21D7/14
- IPC: B21D7/14 ; H01B7/08 ; B21D7/022 ; H01R11/12 ; H01B13/012 ; B21C37/15 ; H01R11/28 ; B60R16/02 ; H01B7/00
Abstract:
A wiring member includes a laminated flat conductor and an insulating layer provided around the laminated flat conductor. The laminated flat conductor includes a plurality of flat conductors laid on each other in a thickness direction of the laminated flat conductor, and insulating sheet members each of which is interposed between and electrically insulates adjacent ones of the plurality of flat conductors.
Public/Granted literature
- US20180174716A1 Wiring Member, Manufacturing Method of Wiring Member, and Wiring Member Connection Structure Public/Granted day:2018-06-21
Information query
