Invention Grant
- Patent Title: Package assembly for thin wafer shipping and method of use
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Application No.: US16023533Application Date: 2018-06-29
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Publication No.: US10468280B2Publication Date: 2019-11-05
- Inventor: Damyon L. Corbin , Charles F. Musante
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Alvin Borromeo; Andrew M. Calderon
- Main IPC: H01L21/673
- IPC: H01L21/673 ; B65B5/06 ; B65B7/16 ; B65B61/20
Abstract:
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
Public/Granted literature
- US20180308734A1 PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE Public/Granted day:2018-10-25
Information query
IPC分类:
