Invention Grant
- Patent Title: Workpiece processing method
-
Application No.: US15938832Application Date: 2018-03-28
-
Publication No.: US10468302B2Publication Date: 2019-11-05
- Inventor: Kenji Takenouchi
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JP2017-074248 20170404
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/304 ; H01L21/683 ; H01L21/268 ; B28D5/02

Abstract:
A processing method for processing a plate-shaped workpiece having a division line on the front side and a multilayer member containing metal on the division line is provided. The processing method includes a holding step of holding the back side of the workpiece on a holding table in the condition where the multilayer member formed on the division line is exposed, a cutting step of cutting the workpiece along the division line by using a cutting blade after performing the holding step, thereby forming a cut groove dividing the multilayer member, and a laser processing step of applying a laser beam to the workpiece along the cut groove after performing the cutting step. The cutting step includes the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.
Public/Granted literature
- US20180286756A1 WORKPIECE PROCESSING METHOD Public/Granted day:2018-10-04
Information query
IPC分类: