An electronic component mounting board includes a substrate on which an electronic component is mountable. The substrate includes a plurality of layers stacked on one another, a plurality of conductor layers located between the plurality of layers, and a recess located continuously over side surfaces of the plurality of layers. The electronic component mounting board includes an electrode located in the recess and covering an end of at least one of the plurality of conductor layers in the recess. The conductor layers contain a metal material different from a metal material contained in the electrode. The conductor layers have outer edges located inward from an outer edge of the substrate in a plan view.