Invention Grant
- Patent Title: Package for an electronic component, electronic component and electronic arrangement
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Application No.: US15775584Application Date: 2015-11-12
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Publication No.: US10468337B2Publication Date: 2019-11-05
- Inventor: Sok Gek Beh , Siew Lee Yeoh , Wing Yew Wong
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- International Application: PCT/EP2015/076461 WO 20151112
- International Announcement: WO2017/080605 WO 20170518
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L25/075 ; H01L33/48 ; H01L33/62 ; H01L23/498 ; H01L23/00
Abstract:
A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and a third section which are electrically isolated from one another. The first section and the second section each include an L-shape.
Public/Granted literature
- US20180374784A1 PACKAGE FOR AN ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND ELECTRONIC ARRANGEMENT Public/Granted day:2018-12-27
Information query
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