Invention Grant
- Patent Title: Device package including molding compound having non-planar top surface around a die
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Application No.: US15717300Application Date: 2017-09-27
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Publication No.: US10468377B2Publication Date: 2019-11-05
- Inventor: Chen-Hua Yu , Meng-Tse Chen , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L21/56 ; H01L23/538
Abstract:
A device package includes a die and a molding compound around the die. The molding compound has a non-planar surface recessed from a top surface of the die. The device package also includes an interconnect structure over the die. The interconnect structure includes a redistribution layer extending onto the molding compound and conformal to the non-planar surface of the molding compound. The device package further includes a first connector disposed over the die and bonded to the interconnect structure.
Public/Granted literature
- US20180033767A1 Device Package with Reduced Thickness and Method for Forming Same Public/Granted day:2018-02-01
Information query
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