Invention Grant
- Patent Title: SRAM cell and logic cell design
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Application No.: US16051199Application Date: 2018-07-31
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Publication No.: US10468418B2Publication Date: 2019-11-05
- Inventor: Fang Chen , Kuo-Chiang Ting , Jhon Jhy Liaw , Min-Chang Liang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L49/02 ; H01L23/528 ; H01L27/11582 ; H01L21/8238 ; H01L23/522 ; H01L27/088

Abstract:
An embodiment is an integrated circuit structure including a static random access memory (SRAM) cell having a first number of semiconductor fins, the SRAM cell having a first boundary and a second boundary parallel to each other, and a third boundary and a fourth boundary parallel to each other, the SRAM cell having a first cell height as measured from the third boundary to the fourth boundary, and a logic cell having the first number of semiconductor fins and the first cell height.
Public/Granted literature
- US20180337189A1 SRAM Cell and Logic Cell Design Public/Granted day:2018-11-22
Information query
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