Invention Grant
- Patent Title: Metal-insulator-metal (MIM) capacitor structure and method for forming the same
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Application No.: US15794139Application Date: 2017-10-26
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Publication No.: US10468478B2Publication Date: 2019-11-05
- Inventor: Chih-Fan Huang , Chih-Yang Pai , Yuan-Yang Hsiao , Tsung-Chieh Hsiao , Hui-Chi Chen , Dian-Hau Chen , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L23/64 ; H01G4/10 ; H01G4/012

Abstract:
A metal-insulator-metal (MIM) capacitor structure and a method for forming the same are provided. The MIM capacitor structure includes a substrate, a bottom electrode layer, a first dielectric layer, a top electrode layer and first dielectric spacers. The bottom electrode layer is positioned over the substrate. The first dielectric layer is positioned over the bottom electrode layer. The top electrode layer is positioned over the first dielectric layer. The first dielectric spacers are positioned on opposite sidewalls of the bottom electrode layer. The first dielectric layer has a first dielectric constant. The first dielectric spacers have a second dielectric constant that is lower than the first dielectric constant.
Public/Granted literature
- US20190131385A1 METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2019-05-02
Information query
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