Invention Grant
- Patent Title: Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection support
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Application No.: US15574385Application Date: 2016-04-19
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Publication No.: US10468569B2Publication Date: 2019-11-05
- Inventor: Jörg Erich Sorg , Stefan Ziegler , Michael Austgen , Alexander Peetsch , Eckhard Ditzel , Michael Benedikt
- Applicant: OSRAM GmbH , ALANOD GmbH & Co. KG , Heraeus Deutschland GmbH & Co. KG
- Applicant Address: DE Regensburg DE Hanau DE Ennepetal
- Assignee: OSRAM Opto Semiconductor GmbH,Heraeus Deutschland Gmbh & Co. KG,ALANOD GmbH & Co. KG
- Current Assignee: OSRAM Opto Semiconductor GmbH,Heraeus Deutschland Gmbh & Co. KG,ALANOD GmbH & Co. KG
- Current Assignee Address: DE Regensburg DE Hanau DE Ennepetal
- Agency: DLA Piper LLP (US)
- Priority: DE102015107657 20150515
- International Application: PCT/EP2016/058643 WO 20160419
- International Announcement: WO2016/184632 WO 20161124
- Main IPC: H01L33/62
- IPC: H01L33/62 ; B32B15/04 ; H01L23/00 ; H01L31/02 ; B32B15/08 ; H05K1/05 ; H05K3/10 ; B32B15/00 ; B32B7/12 ; B32B37/12 ; H01L25/16 ; H01L33/54 ; H05K3/00 ; H05K3/38

Abstract:
A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.
Public/Granted literature
Information query
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