Invention Grant
- Patent Title: Connector structure and manufacturing method thereof
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Application No.: US15978174Application Date: 2018-05-13
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Publication No.: US10468824B2Publication Date: 2019-11-05
- Inventor: Hsien-Chang Lin , Kuei-Tien Fu
- Applicant: P-TWO INDUSTRIES INC.
- Applicant Address: TW Taoyuan
- Assignee: P-TWO INDUSTRIES INC.
- Current Assignee: P-TWO INDUSTRIES INC.
- Current Assignee Address: TW Taoyuan
- Agent Winston Hsu
- Priority: TW106126496A 20170803
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R13/6585 ; H01R13/502 ; H01R13/6593 ; H01R13/504 ; H01R12/72 ; H01R24/62

Abstract:
A connector structure includes an insulating main body, a shielding plate, a plurality of first terminals, a plurality of second terminals, a protecting component and a housing. The insulating main body includes a base portion and a tongue portion extending out of the base portion, and the tongue portion includes a first surface, a second surface opposite to the first surface, and two lateral surfaces disposed between the first surface and the second surface. The shielding plate is disposed inside the tongue portion and between the first surface and the second surface. The first terminals are disposed on the first surface. The second terminals are disposed on the second surface. The protecting component is disposed on the two lateral surfaces of the tongue portion. The housing surrounds the tongue portion to define a docking space, and an opening is formed on a side of the docking space.
Public/Granted literature
- US20190044287A1 CONNECTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-02-07
Information query