Invention Grant
- Patent Title: Assembly having thermal conduction members
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Application No.: US16019850Application Date: 2018-06-27
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Publication No.: US10468839B2Publication Date: 2019-11-05
- Inventor: Ted Ju , Chin Chi Lin
- Applicant: LOTES CO., LTD
- Applicant Address: TW Keelung
- Assignee: LOTES CO., LTD
- Current Assignee: LOTES CO., LTD
- Current Assignee Address: TW Keelung
- Agency: Locke Lord LLP
- Agent Tim TingKang Xia, Esq.
- Priority: CN201720770569U 20170629; CN201720770570U 20170629
- Main IPC: H01R24/78
- IPC: H01R24/78 ; H01R43/02 ; H01R13/66 ; H05K7/20 ; H01R13/516

Abstract:
An assembly includes: a socket connector, having an insulating seat, multiple mating terminals and a metal shell provided outside the insulating seat; at least one first thermal conduction member located outside the metal shell; and a plug connector, including: a circuit board; at least one chip provided on the circuit board; a mating joint electrically connected to one end of the circuit board and having an insulating body, multiple conductive terminals, and a shielding shell provided outside the insulating body; and at least one second thermal conduction member having a conducting portion thermally conductive with the chip and a protruding portion located outside the shielding shell. When the mating joint is mated with the socket connector, the mating terminals are in contact with the conductive terminals to form an electrical connection, and the protruding portion is in contact with the first thermal conduction member to perform thermal conduction.
Public/Granted literature
- US20190006802A1 ASSEMBLY HAVING THERMAL CONDUCTION MEMBERS Public/Granted day:2019-01-03
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