A piezoelectric module includes a piezoelectric thin film, a fixing layer, and a support substrate. The piezoelectric thin film is supported by the support substrate with the fixing layer in between. Functional conductors are provided on a surface of the piezoelectric thin film. A void is provided in the fixing layer to include a region overlapping with the functional conductors. A conductor pattern defining a circuit element is provided in a region of the void on a surface of the support substrate on the fixing layer side.