A preparation process of a copper powder metal plating layer, a metal substrate having the copper powder metal plating layer, an energy-saving anti-burst heat dissipation device and a preparation process thereof; the process of preparing the copper powder metal plating layer comprises the step of attaching the metal layer; the temperature of the liquid in the work tank is kept within a range of 1-15° C.; the attachment process of the metal layer comprises at least the steps of: attaching the bottom layer, attaching the snowflake-shaped layer and attaching the fastening layer.