Invention Grant
- Patent Title: Reduction of passive components in system-in-package devices
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Application No.: US15968171Application Date: 2018-05-01
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Publication No.: US10470294B2Publication Date: 2019-11-05
- Inventor: Erik James Welsh , Peter Linder
- Applicant: Octavo Systems LLC
- Applicant Address: US TX Austin
- Assignee: OCTAVO SYSTEMS LLC
- Current Assignee: OCTAVO SYSTEMS LLC
- Current Assignee Address: US TX Austin
- Agency: Rothwell, Figg, Ernst & Manbeck P.C.
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K1/02 ; G06F17/50 ; H01L25/16 ; H05K1/18
Abstract:
Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.
Public/Granted literature
- US20180317316A1 REDUCTION OF PASSIVE COMPONENTS IN SYSTEM-IN-PACKAGE DEVICES Public/Granted day:2018-11-01
Information query
