Invention Grant
- Patent Title: Printed circuit board, printed wiring board, and differential transmission circuit
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Application No.: US15518135Application Date: 2015-10-22
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Publication No.: US10470296B2Publication Date: 2019-11-05
- Inventor: Jin Miyasaka
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Venable LLP
- Priority: JP2014-223999 20141104; JP2015-196419 20151002
- International Application: PCT/JP2015/080472 WO 20151022
- International Announcement: WO2016/072337 WO 20160512
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18

Abstract:
Provided is a printed circuit board including a first semiconductor device and a second semiconductor device mounted on a printed wiring board, the printed wiring board including a first and a second differential signal wirings each formed of a pair of signal transmission lines. The pair of signal transmission lines forming the first differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the first differential signal wiring in a wiring direction thereof. The pair of signal transmission lines forming the second differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the second differential signal wiring in a wiring direction thereof.
Public/Granted literature
- US20170303391A1 PRINTED CIRCUIT BOARD, PRINTED WIRING BOARD, AND DIFFERENTIAL TRANSMISSION CIRCUIT Public/Granted day:2017-10-19
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