Invention Grant
- Patent Title: Circuit board including dummy electrode formed on substrate
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Application No.: US15938123Application Date: 2018-03-28
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Publication No.: US10470298B2Publication Date: 2019-11-05
- Inventor: Shoko Ota , Nobumasa Tanaka , Ryuji Horata
- Applicant: BROTHER KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Nagoya-Shi, Aichi-Ken
- Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Nagoya-Shi, Aichi-Ken
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2017-073003 20170331
- Main IPC: B41J2/175
- IPC: B41J2/175 ; H05K1/02 ; H05K1/11 ; H05K1/18

Abstract:
A circuit board to be mounted on a casing of a cartridge includes an insulating substrate, an integrated circuit mounted on the substrate, terminals and a dummy electrode. The terminals are electrically connected to the integrated circuit, while the dummy electrode is electrically disconnected from the integrated circuit. The terminals and dummy electrode are formed on the substrate to satisfy an inequity of L1+L2
Public/Granted literature
- US20180288869A1 CIRCUIT BOARD INCLUDING DUMMY ELECTRODE FORMED ON SUBSTRATE Public/Granted day:2018-10-04
Information query
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