Invention Grant
- Patent Title: Indium phosphide substrate, method of inspecting indium phosphide substrate, and method of producing indium phosphide substrate
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Application No.: US15541754Application Date: 2015-12-07
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Publication No.: US10473445B2Publication Date: 2019-11-12
- Inventor: Shinya Fujiwara , Yasuaki Higuchi
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2015-023050 20150209
- International Application: PCT/JP2015/084273 WO 20151207
- International Announcement: WO2016/129172 WO 20160818
- Main IPC: G01B5/28
- IPC: G01B5/28 ; H01L29/34 ; B24B37/08 ; B24B37/10 ; C30B33/00 ; G01Q60/24 ; H01L21/02 ; H01L29/20 ; B24B57/02 ; C30B25/20 ; C30B29/40 ; H01L33/00 ; C30B11/00

Abstract:
An indium phosphide substrate, a method of inspecting thereof and a method of producing thereof are provided, by which an epitaxial film grown on the substrate is rendered excellently uniform, thereby allowing improvement in PL characteristics and electrical characteristics of an epitaxial wafer formed using this epitaxial film. The indium phosphide substrate has a first main surface and a second main surface, a surface roughness Ra1 at a center position on the first main surface, and surface roughnesses Ra2, Ra3, Ra4, and Ra5 at four positions arranged equidistantly along an outer edge of the first main surface and located at a distance of 5 mm inwardly from the outer edge. An average value m1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.5 nm or less, and a standard deviation σ1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.2 nm or less.
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